Method of manufacturing semiconductor device

ABSTRACT

A method of manufacturing a semiconductor device includes forming a second SiC layer of a first conductivity type on a first SiC layer by epitaxial growth, forming a first region of a second conductivity type by selectively ion-implanting first impurities of the second conductivity type into the second SiC layer, removing a portion of the first region, forming a third SiC layer of the first conductivity type on the second SiC layer by epitaxial growth, and forming a second region of the second conductivity type on the first region by selectively ion-implanting second impurities of the second conductivity type into the third SiC layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2015-179329, filed Sep. 11, 2015, theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a method ofmanufacturing a semiconductor device.

BACKGROUND

Power control semiconductor devices that can achieve both a highbreakdown voltage and a low on-resistance include a vertical metal oxidesemiconductor field effect transistor (MOSFET) having a super junctionstructure (hereinafter, also referred to as an “SJ structure”) in whicha p type (or n type) semiconductor layer is embedded in an n type (or ptype) semiconductor layer and n type regions and p type regions arealternately arranged. In the SJ structure, a wide depletion region isformed by equalizing the amount of n type impurities included in the ntype region to the amount of p type impurities included in the p typeregion to realize a high breakdown voltage. In addition, it is possibleto realize a low on-resistance by providing a high impurityconcentration region to which a current is applied. In order to stablyrealize a high breakdown voltage, it is preferable to form the n typeand p type regions having a uniform impurity concentration.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view of a semiconductor devicemanufactured by a method of manufacturing a semiconductor device,according to a first embodiment.

FIGS. 2-4 are each a schematic cross-sectional view of the semiconductordevice during manufacturing according to the first embodiment.

FIG. 5 is a diagram illustrating an example of a concentration profilein a depth direction when aluminum in SiC is ion-implanted.

FIGS. 6-13 are each a schematic cross-sectional view of thesemiconductor device during manufacturing according to the firstembodiment.

FIG. 14 is a schematic cross-sectional view of a semiconductor devicemanufactured by a method of manufacturing a semiconductor device,according to a comparative example.

FIGS. 15-23 are each a schematic cross-sectional view of a semiconductordevice during manufacturing according to a second embodiment.

FIGS. 24-32 are each a schematic cross-sectional view of a semiconductordevice during manufacturing according to a fourth embodiment.

FIG. 33 is a schematic cross-sectional view of a semiconductor devicemanufactured by a method of manufacturing a semiconductor deviceaccording to a fifth embodiment.

FIGS. 34-44 are each a schematic cross-sectional view of thesemiconductor device during manufacturing according to the fifthembodiment.

DETAILED DESCRIPTION

Embodiments provide a method of manufacturing a semiconductor devicecapable of realizing a high breakdown voltage.

In general, according to one embodiment, a method of manufacturing asemiconductor device, the method including forming a second SiC layer ofa first conductivity type on a first SiC layer by epitaxial growth,forming a first region of a second conductivity type by selectivelyion-implanting first impurities of the second conductivity type into thesecond SiC layer, removing a portion of the first region, forming athird SiC layer of the first conductivity type on the second SiC layerby epitaxial growth, and forming a second region of the secondconductivity type on the first region by selectively ion-implantingsecond impurities of the second conductivity type into the third SiClayer.

Hereinafter, embodiments will be described with reference to theaccompanying drawings. In the following description, the same or similarelements are denoted by the same reference numerals and signs, and adescription of elements described once will only be repeated as needed.

In addition, in the following description, signs of n⁺, n, n⁻, p⁺, p,and p⁻ indicate relative levels of impurity concentrations of therespective conductivity types. That is, n⁺ has an n type impurityconcentration higher than that of n and n⁻ has an n type impurityconcentration lower than that of n. In addition, p⁺ has a p typeimpurity concentration higher than that of p and p⁻ has a p typeimpurity concentration lower than that of p. Meanwhile, the n⁺ type andthe n⁻ type may be simply referred to as an n type, and the p⁺ type andthe p⁻ type may be simply referred to as a p type.

First Embodiment

In a method of manufacturing a semiconductor device according to thepresent embodiment, a second SiC layer of a first conductivity type isformed on a first SiC layer by epitaxial growth, first impurities of asecond conductivity type are selectively ion-implanted into a second SiClayer to form a first region of the second conductivity type, a portionof the first region is removed to form a third SiC layer of the firstconductivity type on the second SiC layer by epitaxial growth, andsecond impurities of the second conductivity type are selectivelyion-implanted into the third SiC layer to form a second region of thesecond conductivity type on the first region.

FIG. 1 is a schematic cross-sectional view of a semiconductor devicemanufactured by the method of manufacturing a semiconductor device,according to the present embodiment. The semiconductor devicemanufactured by the method according to the present embodiment is avertical MOSFET 100 that has a super junction structure using siliconcarbide (SiC). In the description hereinafter, an example will be givenin which a first conductivity type is an n type and a secondconductivity type is a p type.

The MOSFET 100 includes an n⁺ type SiC substrate 10, an n⁻ type bufferlayer 12, an n⁻ type drift region 14, a p⁻ type pillar region 16, a ptype body region 18, an n⁺ type source region 20, a p⁺ type contactregion 22, a gate insulating film 24, a gate electrode 26, an interlayerfilm 28, a source electrode 30, and a drain electrode 32.

The MOSFET 100 is configured such that the n⁻ type drift region 14 andthe p⁻ type pillar region 16 are depleted during a turn-off operation toform a wide depletion region, to thereby realize a high breakdownvoltage. In addition, it is possible to increase the impurityconcentration of the n⁻ type drift region 14 by providing the p⁻ typepillar region 16. Therefore, it is possible to realize a lowon-resistance during a turn-on operation.

The n⁻ type drift region 14 contains n type impurities. The n typeimpurity is, for example, nitrogen (N). The impurity concentration ofthe n type impurity is, for example, equal to or higher than 1×10¹⁵ cm³and equal to or lower than 1×10¹⁷ cm⁻³.

The p⁻ type pillar region 16 contains p type impurities. The p typeimpurity is, for example, aluminum (Al). The impurity concentration ofthe p type impurity is, for example, equal to or higher than 1×10¹⁵ cm⁻³and equal to or lower than 1×10¹⁸ cm⁻³.

FIGS. 2 to 4 and FIGS. 6 to 13 are schematic cross-sectional views ofthe semiconductor device during manufacturing according to the presentembodiment. FIG. 5 is a diagram illustrating an example of aconcentration profile in a depth direction when aluminum in SiC ision-implanted.

First, the n⁺ type SiC substrate 10 is prepared. The SiC substrate 10is, for example, a 4H—SiC single crystal substrate. For example, thesurface of the SiC substrate 10 is a surface which is inclined at equalto or greater than 0 degrees and equal to or less than 8 degrees withrespect to a (0001) surface.

Next, the n⁻ type buffer layer (first SiC layer) 12 is formed on the SiCsubstrate 10 (FIG. 2). The buffer layer 12 is formed by an epitaxialgrowth method. A film thickness of the buffer layer 12 is, for example,equal to or greater than 0.1 μm and equal to or less than 1.0 μm.

Next, an n⁻ type first n type epitaxial layer (second SiC layer) 50 isformed on the buffer layer 12 (FIG. 3). The first n type epitaxial layer50 is formed by an epitaxial growth method. A film thickness of thefirst n type epitaxial layer 50 is, for example, equal to or greaterthan 0.1 μm and equal to or less than 1.0 μm.

Next, a mask material 60 is formed on the first n type epitaxial layer50. The mask material 60 is, for example, a silicon oxide film.

Next, aluminum (first impurity) is selectively ion-implanted into thefirst n type epitaxial layer 50 using the mask material 60 as a mask(FIG. 4). A p⁻ type first p type region (first region) 70 is formed inthe first n type epitaxial layer 50 by the ion implantation of aluminum.The first p type region 70 includes a high impurity concentration region70 a and a low impurity concentration region 70 b.

The ion implantation of aluminum may be performed a plurality of timeswhile changing acceleration energy so that the concentration of aluminumin the first p type region 70 becomes uniform in a film thicknessdirection.

FIG. 5 is a diagram illustrating an example of a concentration profilein a depth direction when aluminum in SiC is ion-implanted. When a peakconcentration is present at a position separated from the surface atapproximately 0.2 μm, a low impurity concentration region having, forexample, an aluminum concentration set to be equal to or less than halfof the peak concentration is formed in a range separated from thesurface at approximately 0.1 μm.

A diffusion coefficient of the impurities in SiC is smaller than, forexample, a diffusion coefficient of impurities in silicon (Si). Inparticular, a diffusion coefficient of aluminum in SiC is extremelysmall. Therefore, even when activation annealing of impurities isperformed after ion implantation, there is an extremely small change ina concentration profile immediately after the ion implantation.

Next, the mask material 60 is peeled off (FIG. 6). The peeling-off ofthe mask material is performed by, for example, wet etching.

Next, activation annealing for activating the ion-implanted aluminum isperformed. The activation annealing is performed at a temperature ofequal to or higher than 1,700° C. and equal to or lower than 1,900° C.,for example, in a non-oxidizing atmosphere.

Next, the surface of the first n type epitaxial layer 50 is polished bychemical mechanical polishing (CMP), and the low impurity concentrationregion 70 b which is a portion of the first p type region 70 is removed(FIG. 7).

When a portion of the first p type region 70 is removed by CMP, it ispreferable to remove a region in which a peak concentration position ofaluminum is present in the portion of the first p type region 70. Athickness of the portion of the first p type region 70 which is removedis, for example, equal to or greater than 0.05 μm and equal to or lessthan 0.2 μm.

It is preferable to perform CMP under a process condition having a highchemical etching component. For example, it is preferable to include ahydrogen peroxide solution (H₂O₂) with slurry. After the portion of thefirst p type region 70 is removed by CMP, any one or a combination ofisotropic dry etching, anisotropic dry etching using a condition havinga strong chemical action, the formation and peeling-off of a thermaloxide film, and wet etching, may be performed.

After the portion of the first p type region 70 is removed by CMP,isotropic dry etching may be performed. A portion of the first n typeepitaxial layer 50 is removed by isotropic dry etching.

Damages such as scratches generated in the first n type epitaxial layer50 due to CMP are removed by isotropic dry etching. Thereafter, thecrystallizability of the SiC layer epitaxially grown on the first n typeepitaxial layer 50 is improved.

The isotropic dry etching is, for example, chemical dry etching (CDE).

After the portion of the first p type region 70 is removed by CMP,anisotropic dry etching using a condition having a strong chemicalaction may be performed. A portion of the first n type epitaxial layer50 is removed by anisotropic dry etching having a strong chemicalaction.

Damages such as scratches generated in the first n type epitaxial layer50 due to CMP are removed by anisotropic dry etching using a conditionhaving a strong chemical action. Thereafter, the crystallizability ofthe SiC layer epitaxially grown on the first n type epitaxial layer 50is improved.

The anisotropic dry etching using a condition having a strong chemicalaction is, for example, reactive ion etching (RIE) using a sulfurhexafluoride (SF₆) gas or a carbon tetrafluoride (CF₄) gas.

After the portion of the first p type region 70 is removed by CMP, athermal oxide film may be formed on the first n type epitaxial layer 50and then peeled off. A portion of the first n type epitaxial layer 50 isremoved by the formation and peeling-off of the thermal oxide film.

Damages such as scratches generated in the first n type epitaxial layer50 due to CMP are removed by the formation and peeling-off of thethermal oxide film. Thereafter, the crystallizability of the SiC layerepitaxially grown on the first n type epitaxial layer 50 is improved.

After the portion of the first p type region 70 is removed by CMP, wetetching may be performed. A portion of the first n type epitaxial layer50 is removed by wet etching.

Damages such as scratches generated in the first n type epitaxial layer50 due to CMP are removed by wet etching. Thereafter, thecrystallizability of the SiC layer epitaxially grown on the first n typeepitaxial layer 50 is improved.

The wet etching is, for example, etching using nitrohydrofluoric acid(HF+HNO₃) as a liquid chemical.

Next, an n⁻ type second n type epitaxial layer (third SiC layer) 52 isformed on the first n type epitaxial layer 50 (FIG. 8). The second ntype epitaxial layer 52 is formed by an epitaxial growth method. A filmthickness of the second n type epitaxial layer 52 is, for example, equalto or greater than 0.1 μm and equal to or less than 1.0 μm.

Next, aluminum (second impurity) is selectively ion-implanted into thesecond n type epitaxial layer 52 using a mask material 62 as a mask(FIG. 9). A p⁻ type second p type region (second region) 72 is formed inthe second n type epitaxial layer 52 by the ion implantation ofaluminum. The second p type region 72 includes a high impurityconcentration region 72 a and a low impurity concentration region 72 b.The second p type region 72 is formed on the first p type region 70.

The ion implantation of aluminum may be performed a plurality of timeswhile changing acceleration energy so that the concentration of aluminumin the second p type region 72 becomes uniform in a film thicknessdirection.

Next, the mask material 62 is peeled off. Next, the surface of thesecond n type epitaxial layer 52 is polished by the CMP, and the lowimpurity concentration region 72 b which is a portion of the second ptype region 72 is removed (FIG. 10).

Next, activation annealing for activating the ion-implanted aluminum isperformed. The activation annealing is performed at a temperature ofequal to or higher than 1,700° C. and equal to or lower than 1,900° C.,for example, in a non-oxidizing atmosphere.

Next, an n⁻ type third n type epitaxial layer 54 is formed on the secondn type epitaxial layer 52. The third n type epitaxial layer 54 is formedby an epitaxial growth method. A film thickness of the third n typeepitaxial layer 54 is, for example, equal to or greater than 0.1 μm andequal to or less than 1.0 μm.

Next, aluminum is selectively ion-implanted into the third n typeepitaxial layer 54 using a mask material 64 as a mask (FIG. 11). A p⁻type third p type region 74 is formed in the third n type epitaxiallayer 54 by the ion implantation of aluminum. The third p type region 74includes a high impurity concentration region 74 a and a low impurityconcentration region 74 b. The third p type region 74 is formed on thesecond p type region 72.

The ion implantation of aluminum may be performed a plurality of timeswhile changing acceleration energy so that the concentration of aluminumin the third p type region 74 becomes uniform in a film thicknessdirection.

Next, the mask material 64 is peeled off. Next, the surface of the thirdn type epitaxial layer 54 is polished by the CMP, and the low impurityconcentration region 74 b which is a portion of the third p type region74 is removed (FIG. 12).

Next, activation annealing for activating the ion-implanted aluminum isperformed. The activation annealing is performed at a temperature ofequal to or higher than 1,700° C. and equal to or lower than 1,900° C.,for example, in a non-oxidizing atmosphere.

Next, an n⁻ type surface layer 56 is formed on the third n typeepitaxial layer 54 (FIG. 13). The surface layer 56 is formed by anepitaxial growth method. A film thickness of the surface layer 56 is,for example, equal to or greater than 0.1 μm and equal to or less than1.0 μm.

Thereafter, the p type body region 18, the n⁺ type source region 20, thep⁺ type contact region 22, the gate insulating film 24, the gateelectrode 26, the interlayer film 28, the source electrode 30, and thedrain electrode 32 are formed by a conventional process. The MOSFET 100illustrated in FIG. 1 is formed by the manufacturing method describedabove.

Next, operations and effects of the method of manufacturing asemiconductor device according to the present embodiment will bedescribed. FIG. 14 is a schematic cross-sectional view of asemiconductor device manufactured by a method of manufacturing asemiconductor device according to a comparative example. Thesemiconductor device according to the comparative example is a verticalMOSFET 900 that has a super junction structure using silicon carbide(SiC).

The method of manufacturing a semiconductor device according to thecomparative example is different from the method of manufacturing asemiconductor device according to the present embodiment in that lowimpurity concentration regions 70 b, 72 b, and 74 b are not removed.Therefore, in the MOSFET 900, the low impurity concentration regions 70b, 72 b, and 74 b are present in a p⁻ type pillar region 16.

When the low impurity concentration regions 70 b, 72 b, and 74 b arepresent in the p⁻ type pillar region 16 of the MOSFET 900, a depletionlayer extending to an n⁻ type drift region 14 and the p⁻ type pillarregion 16 becomes non-uniform during a turn-off operation of the MOSFET900. For this reason, a breakdown voltage of the MOSFET 900 becomesunstable, and thus there is a concern that the breakdown voltage mightbe reduced.

In the MOSFET 100 manufactured by the manufacturing method according tothe present embodiment, the low impurity concentration regions 70 b, 72b, and 74 b are not present. In other words, the concentration of p typeimpurities in the p⁻ type pillar region 16 becomes uniform. Therefore, adepletion layer extending to the n⁻ type drift region 14 and the p⁻ typepillar region 16 becomes uniform during a turn-off operation of theMOSFET 100. Accordingly, a breakdown voltage of the MOSFET 100 isstabilized, and thus a high breakdown voltage is realized.

In addition, in the manufacturing method according to the presentembodiment, it is possible to flatten irregularities, such as stepbunching, which are formed in the surface during the epitaxial growth ofeach of the first epitaxial layer 50, the second epitaxial layer 52, andthe third epitaxial layer 54. Therefore, the crystallizability of anepitaxial growth layer which is formed subsequent to each of the layersis improved.

As described above, according to the present embodiment, the method ofmanufacturing a semiconductor device capable of realizing a highbreakdown voltage is provided.

Second Embodiment

A method of manufacturing a semiconductor device according to thepresent embodiment is different from that in the first embodiment inthat a portion of a first region is removed by the formation of athermal oxide film on a first region and peeling-off of the thermaloxide film instead of being removed by CMP. A portion of a descriptionoverlapping with that in the first embodiment will be omitted.

FIGS. 15 to 23 are schematic cross-sectional views of a semiconductordevice during manufacturing in the method of manufacturing asemiconductor device according to the present embodiment.

First, an n⁺ type SiC substrate 10 is prepared. Next, an n⁻ type bufferlayer (first SiC layer) 12 is formed on the SiC substrate 10 (FIG. 15).

Next, an n⁻ type first n type epitaxial layer (second SiC layer) 50 isformed on the buffer layer 12 (FIG. 16).

Next, a mask material 60 is formed on the first n type epitaxial layer50. A mask material 60 is, for example, a silicon oxide film.

Next, aluminum (first impurity) is selectively ion-implanted into thefirst n type epitaxial layer 50 using the mask material 60 as a mask(FIG. 17). A p⁻ type first p type region (first region) 70 is formed inthe first n type epitaxial layer 50 by the ion implantation of aluminum.The first p type region 70 includes a high impurity concentration region70 a and a low impurity concentration region 70 b.

Next, the mask material 60 is peeled off (FIG. 18). Next, activationannealing for activating the ion-implanted aluminum is performed.

Next, a thermal oxide film 80 is formed on the surface of the first ntype epitaxial layer 50 by thermal oxidation (FIG. 19). The low impurityconcentration region 70 b which is a portion of the first p type region70 is oxidized by thermal oxidation.

Next, the thermal oxide film 80 is peeled off. The thermal oxide film 80is removed, for example, by wet etching using hydrofluoric acid as aliquid chemical. The low impurity concentration region 70 b is removedby the peeling-off of the thermal oxide film 80 (FIG. 20).

When a portion of the first p type region 70 is removed by the formationof the thermal oxide film 80 and the peeling-off of the thermal oxidefilm 80, it is preferable to remove a region in which a peakconcentration position of aluminum is present in the portion of thefirst p type region 70. A thickness of the portion of the first p typeregion 70 which is removed is, for example, equal to or greater than0.05 μm and equal to or less than 0.2 μm.

Next, an n⁻ type second n type epitaxial layer (third SiC layer) 52 isformed on the first n type epitaxial layer 50 (FIG. 21).

Next, aluminum (second impurity) is selectively ion-implanted into thesecond n type epitaxial layer 52 using a mask material 62 as a mask(FIG. 22). A p⁻ type second p type region (second region) 72 is formedin the second n type epitaxial layer 52 by the ion implantation ofaluminum. The second p type region 72 includes a high impurityconcentration region 72 a and a low impurity concentration region 72 b.

Next, the mask material 62 is peeled off. Next, activation annealing foractivating the ion-implanted aluminum is performed.

Next, a thermal oxide film is formed on the surface of the second n typeepitaxial layer 52 by thermal oxidation. The low impurity concentrationregion 72 b which is a portion of the second p type region 72 isoxidized by thermal oxidation.

Next, the thermal oxide film is peeled off. The low impurityconcentration region 72 b is removed by the peeling-off of the thermaloxide film.

Next, an n⁻ type third n type epitaxial layer 54 is formed on the secondn type epitaxial layer 52.

Next, aluminum is selectively ion-implanted into the third n typeepitaxial layer 54 using a mask material as a mask.

Next, a thermal oxide film is formed on the surface of the third n typeepitaxial layer 54 by thermal oxidation. Next, the thermal oxide film ispeeled off.

Next, an n⁻ type surface layer 56 is formed on the third n typeepitaxial layer 54 (FIG. 23).

Thereafter, a p type body region 18, an n⁺ type source region 20, a p⁺type contact region 22, a gate insulating film 24, a gate electrode 26,an interlayer film 28, a source electrode 30, and a drain electrode 32are formed by a conventional process. The MOSFET 100 illustrated in FIG.1 is formed by the manufacturing method described above.

According to the present embodiment, the method of manufacturing asemiconductor device capable of realizing a high breakdown voltage isprovided as in the first embodiment.

Third Embodiment

A method of manufacturing a semiconductor device according to thepresent embodiment is different from that in the first embodiment inthat a portion of a first region is removed by dry etching instead ofbeing removed by the CMP. A portion of the description overlapping withthat in the first embodiment will be omitted.

In the present embodiment, a low impurity concentration region 70 b, alow impurity concentration region 72 b, and a low impurity concentrationregion 74 b are removed by dry etching. The dry etching is, for example,reactive ion etching (RIE). According to the present embodiment, themethod of manufacturing a semiconductor device capable of realizing ahigh breakdown voltage is provided as in the first embodiment.

Fourth Embodiment

In a method of manufacturing a semiconductor device according to thepresent embodiment, a second SiC layer of a first conductivity type isformed on a first SiC layer by epitaxial growth, first impurities of asecond conductivity type are selectively ion-implanted into the secondSiC layer to forma first region of the second conductivity type, a thirdSiC layer of the first conductivity type is formed on the second SiClayer by epitaxial growth, and second impurities of the secondconductivity type are selectively ion-implanted into the third SiC layerto form a second region of the second conductivity type on the firstregion, and a peak concentration position of the second impurities isformed in the first region.

FIGS. 24 to 32 are schematic cross-sectional views of a semiconductordevice during manufacturing in the method of manufacturing asemiconductor device according to the present embodiment.

First, an n⁺ type SiC substrate 10 is prepared. The SiC substrate 10 is,for example, a 4H—SiC single crystal substrate. For example, the surfaceof the SiC substrate 10 is a surface which is inclined at equal to orgreater than 0 degrees and equal to or less than 8 degrees with respectto a (0001) surface.

Next, an n⁻ type buffer layer (first SiC layer) 12 is formed on the SiCsubstrate 10 (FIG. 24). The buffer layer 12 is formed by an epitaxialgrowth method. A film thickness of the buffer layer 12 is, for example,equal to or greater than 0.1 μm and equal to or less than 1.0 μm.

Next, an n⁻ type first n type epitaxial layer (second SiC layer) 50 isformed on the buffer layer 12 (FIG. 25). The first n type epitaxiallayer 50 is formed by an epitaxial growth method. A film thickness ofthe first n type epitaxial layer 50 is, for example, equal to or greaterthan 0.1 μm and equal to or less than 1.0 μm.

Next, a mask material 60 is formed on the first n type epitaxial layer50. The mask material 60 is, for example, a silicon oxide film.

Next, aluminum (first impurity) is selectively ion-implanted into thefirst n type epitaxial layer 50 using the mask material 60 as a mask(FIG. 26). A p⁻ type first p type region (first region) 70 is formed inthe first n type epitaxial layer 50 by the ion implantation of aluminum.The first p type region 70 includes a high impurity concentration region70 a and a low impurity concentration region 70 b.

The ion implantation of aluminum may be performed a plurality of timeswhile changing acceleration energy so that the concentration of aluminumin the first p type region 70 becomes uniform in a film thicknessdirection.

Next, the mask material 60 is peeled off (FIG. 27). The peeling-off ofthe mask material is performed by, for example, wet etching.

Next, activation annealing for activating the ion-implanted aluminum isperformed. The activation annealing is performed at a temperature ofequal to or higher than 1,700° C. and equal to or lower than 1,900° C.,for example, in a non-oxidizing atmosphere.

Next, an n⁻ type second n type epitaxial layer (third SiC layer) 52 isformed on the first n type epitaxial layer 50 (FIG. 28). The second ntype epitaxial layer 52 is formed by an epitaxial growth method. A filmthickness of the second n type epitaxial layer 52 is, for example, equalto or greater than 0.1 μm and equal to or less than 1.0 μm.

Next, aluminum (second impurity) is selectively ion-implanted into thesecond n type epitaxial layer 52 using a mask material 62 as a mask(FIG. 29). A p⁻ type second p type region (second region) 72 is formedin the second n type epitaxial layer 52 by the ion implantation ofaluminum. The second p type region 72 includes a high impurityconcentration region 72 a and a low impurity concentration region 72 b.

The second p type region 72 is formed on the first p type region 70. Apeak concentration position of aluminum (second impurity) which ision-implanted into the first p type region 70 is provided. The peakconcentration position of aluminum is adjusted by adjusting accelerationenergy during the ion implantation of aluminum. For example,acceleration energy is set so that a projected range (Rp) of aluminumbecomes deeper than the film thickness of the second n type epitaxiallayer 52. The concentration of aluminum in the low impurityconcentration region 70 b of the first p type region 70 increases, andthus, for example, the low impurity concentration region 70 bdisappears.

The ion implantation of aluminum may be performed a plurality of timeswhile changing acceleration energy so that the concentration of aluminumin the second p type region 72 becomes uniform in the film thicknessdirection. When the ion implantation is performed a plurality of times,a peak position of aluminum, for example, formed by the ion implantationwith the highest acceleration energy is located in the first p typeregion 70.

Next, the mask material 62 is peeled off (FIG. 30).

Next, activation annealing for activating the ion-implanted aluminum isperformed. The activation annealing is performed at a temperature ofequal to or higher than 1,700° C. and equal to or lower than 1,900° C.,for example, in a non-oxidizing atmosphere.

Next, an n⁻ type third n type epitaxial layer 54 is formed on the secondn type epitaxial layer 52 (FIG. 31). The third n type epitaxial layer 54is formed by an epitaxial growth method. A film thickness of the third ntype epitaxial layer 54 is, for example, equal to or greater than 0.1 μmand equal to or less than 1.0 μm.

Next, aluminum is selectively ion-implanted into the third n typeepitaxial layer 54 using a mask material 64 as a mask (FIG. 32). A p⁻type third p type region 74 is formed in the third n type epitaxiallayer 54 by the ion implantation of aluminum. The third p type region 74includes a high impurity concentration region 74 a and a low impurityconcentration region 74 b.

The third p type region 74 is formed on the second p type region 72. Apeak concentration position of aluminum ion-implanted into the second ptype region 72 is provided. The peak concentration position of aluminumis adjusted by adjusting acceleration energy during the ion implantationof aluminum. For example, acceleration energy is set so that a projectedrange (Rp) of aluminum becomes deeper than the film thickness of thethird n type epitaxial layer 54. The concentration of aluminum in thelow impurity concentration region 72 b of the second p type region 72increases, and thus, for example, the low impurity concentration region72 b disappears.

The ion implantation of aluminum may be performed a plurality of timeswhile changing acceleration energy so that the concentration of aluminumin the third p type region 74 becomes uniform in the film thicknessdirection. When the ion implantation is performed a plurality of times,a peak position of aluminum, for example, formed by the ion implantationwith the highest acceleration energy is located in the second p typeregion 72.

Next, the mask material 64 is peeled off. Next, an n⁻ type surface layer56 is formed on the third n type epitaxial layer 54 (not shown). Thesurface layer 56 is formed by an epitaxial growth method. A filmthickness of the surface layer 56 is, for example, equal to or greaterthan 0.1 μm and equal to or less than 1.0 μm.

Next, activation annealing for activating the ion-implanted aluminum isperformed. The activation annealing is performed at a temperature ofequal to or higher than 1,700° C. and equal to or lower than 1,900° C.,for example, in a non-oxidizing atmosphere.

Thereafter, a p type body region 18, an n⁺ type source region 20, a p⁺type contact region 22, a gate insulating film 24, a gate electrode 26,an interlayer film 28, a source electrode 30, and a drain electrode 32are formed by a conventional process. For example, when the p type bodyregion is formed by ion implantation, the low impurity concentrationregion 74 b becomes part of the p type body region 18. The MOSFET 100illustrated in FIG. 1 is formed by the manufacturing method describedabove.

In the manufacturing method according to the present embodiment,aluminum is also implanted into a p type region in a lower epitaxiallayer during the ion implantation of aluminum when forming a p typeregion in an upper epitaxial layer. Therefore, the concentration ofaluminum of a low impurity concentration region in the lower epitaxiallayer is supplemented, and thus the concentration of aluminum increases.

In the MOSFET 100 manufactured by the manufacturing method according tothe present embodiment, low impurity concentration regions 70 b, 72 b,and 74 b are not present. In other words, the concentration of p typeimpurities in a p⁻ type pillar region 16 becomes uniform. Therefore, adepletion layer extending to an n⁻ type drift region 14 and the p⁻ typepillar region 16 becomes uniform during a turn-off operation of theMOSFET 100. Accordingly, a breakdown voltage of the MOSFET 100 isstabilized, and thus a high breakdown voltage is realized.

As described above, according to the present embodiment, the method ofmanufacturing a semiconductor device capable of realizing a highbreakdown voltage is provided.

Fifth Embodiment

A method of manufacturing a semiconductor device according to thepresent embodiment is different from that in the second embodiment inthat a portion of a first region is selectively removed when a portionof the first region is removed and a groove is formed in the surface ofa second SiC layer. Hereinafter, the description overlapping with thatin the second embodiment will be omitted.

FIG. 33 is a schematic cross-sectional view of a semiconductor devicemanufactured by a method of manufacturing a semiconductor deviceaccording to the present embodiment. The semiconductor device accordingto the present embodiment is a vertical MOSFET 200 that has a superjunction structure using silicon carbide (SiC). In the descriptionhereinafter, an example will be given in which a first conductivity typeis an n type and a second conductivity type is a p type.

The MOSFET 200 includes an n⁺ type SiC substrate 10, an n⁻ type bufferlayer 12, an n⁻ type drift region 14, a p⁻ type pillar region 16, a ptype body region 18, an n⁺ type source region 20, a p⁺ type contactregion 22, a gate insulating film 24, a gate electrode 26, an interlayerfilm 28, a source electrode 30, and a drain electrode 32. The MOSFET 200is a trench contact type MOSFET in which a source electrode 30 is formedwithin a trench.

FIGS. 34 to 44 are schematic cross-sectional views of a semiconductordevice during manufacturing in the method of manufacturing asemiconductor device according to the present embodiment.

First, the n⁺ type SiC substrate 10 is prepared. Next, the n⁻ typebuffer layer (first SiC layer) 12 is formed on the SiC substrate 10(FIG. 34).

Next, an n⁻ type first n type epitaxial layer (second SiC layer) 50 isformed on the buffer layer 12. Next, a mask material 60 is formed on thefirst n type epitaxial layer 50. The mask material 60 is, for example, asilicon oxide film.

Next, aluminum (first impurity) is selectively ion-implanted into thefirst n type epitaxial layer 50 using the mask material 60 as a mask(FIG. 35). A p⁻ type first p type region (first region) 70 is formed inthe first n type epitaxial layer 50 by the ion implantation of aluminum.The first p type region 70 includes a high impurity concentration region70 a and a low impurity concentration region 70 b.

Next, the mask material 60 is peeled off (FIG. 36). Next, activationannealing for activating the ion-implanted aluminum is performed.

Next, a thermal oxide film 82 is formed on the surface of the first ntype epitaxial layer 50 by thermal oxidation (FIG. 37). The low impurityconcentration region 70 b which is a portion of the first p type region70 is oxidized by thermal oxidation so as to have a thickness largerthan that of the first n type epitaxial layer 50. The oxidation isperformed under an oxidation condition in which an oxidation rate of thelow impurity concentration region 70 b containing aluminum becomeshigher than that of the first n type epitaxial layer 50 that does notcontain aluminum.

Next, the thermal oxide film 82 is peeled off. The thermal oxide film 82is removed, for example, by wet etching using hydrofluoric acid as aliquid chemical. The low impurity concentration region 70 b is removedby the peeling-off of the thermal oxide film 82 (FIG. 38). At this time,a groove 90 is formed on the first p type region 70. The groove 90 isformed in the surface of the first n type epitaxial layer 50.

When a portion of the first p type region 70 is removed by the formationand peeling-off of the thermal oxide film 82, it is preferable to removea region in which a peak concentration position of aluminum is presentin the first p type region 70. A thickness of the first p type region 70which is removed is, for example, equal to or greater than 0.05 μm andequal to or less than 0.2 μm.

Next, an n⁻ type second n type epitaxial layer (third SiC layer) 52 isformed on the first n type epitaxial layer 50 (FIG. 39). The groove 90is transferred onto the surface of the second n type epitaxial layer 52.

Next, aluminum (second impurity) is selectively ion-implanted into thesecond n type epitaxial layer 52 using a mask material 62 as a mask(FIG. 40). A p⁻ type second p type region (second region) 72 is formedin the second n type epitaxial layer 52 by the ion implantation ofaluminum. The second p type region 72 includes a high impurityconcentration region 72 a and a low impurity concentration region 72 b.

Next, the mask material 62 is peeled off. Next, activation annealing foractivating the ion-implanted aluminum is performed.

Next, a thermal oxide film 84 is formed on the surface of the second ntype epitaxial layer 52 by thermal oxidation (FIG. 41). The low impurityconcentration region 72 b which is a portion of the second p type region72 is oxidized by thermal oxidation so as to have a thickness largerthan that of the second n type epitaxial layer 52. The oxidation isperformed under an oxidation condition in which an oxidation rate of thelow impurity concentration region 72 b containing aluminum becomeshigher than that of the second n type epitaxial layer 52 that does notcontain aluminum.

Next, the thermal oxide film 84 is peeled off. The thermal oxide film 84is removed, for example, by wet etching using hydrofluoric acid as aliquid chemical. The low impurity concentration region 72 b is removedby the peeling-off of the thermal oxide film 84 (FIG. 42). At this time,the groove 90 on the second p type region 72 becomes deeper.

When a portion of the second p type region 72 is removed by theformation and peeling-off of the thermal oxide film 84, it is preferableto remove a region in which a peak concentration position of aluminum ispresent in the portion of the second p type region 72. A thickness ofthe portion of the second p type region 72 which is removed is, forexample, equal to or greater than 0.05 μm and equal to or less than 0.2μm.

Next, an n⁻ type third n type epitaxial layer 54 is formed on the secondn type epitaxial layer 52 (FIG. 43). The groove 90 is transferred ontothe surface of the third n type epitaxial layer 54.

Next, aluminum is selectively ion-implanted into the third n typeepitaxial layer 54 using a mask material as a mask. A p⁻ type third ptype region is formed in the third n type epitaxial layer 54 by the ionimplantation of aluminum. The third p type region includes a highimpurity concentration region 74 a and a low impurity concentrationregion 74 b.

Next, the mask material is peeled off. Next, activation annealing foractivating the ion-implanted aluminum is performed.

Next, a thermal oxide film is formed on the surface of the third n typeepitaxial layer 54 by thermal oxidation. The low impurity concentrationregion which is a portion of the third p type region is oxidized bythermal oxidation so as to have a thickness larger than that of thethird n type epitaxial layer 54.

Next, the thermal oxide film is peeled off. The low impurityconcentration region is removed, for example, by the peeling-off of thethermal oxide film. At this time, the groove 90 on the third p typeregion becomes deeper.

Next, an n⁻ type surface layer 56 is formed on the third n typeepitaxial layer 54. The groove 90 is transferred onto the surface of thesurface layer 56.

Next, aluminum is selectively ion-implanted into the surface layer 56using a mask material as a mask. A p⁻ type fourth p type region 76 isformed in the surface layer 56 by the ion implantation of aluminum. Thefourth p type region 76 includes a high impurity concentration region 76a and a low impurity concentration region 76 b.

Next, the mask material is peeled off (FIG. 44). Next, activationannealing for activating the ion-implanted aluminum is performed.

Thereafter, the p type body region 18, the n⁺ type source region 20, thep⁺ type contact region 22, the gate insulating film 24, the gateelectrode 26, the interlayer film 28, the source electrode 30, and thedrain electrode 32 are formed by a conventional process.

The source electrode 30 is formed within the groove 90 which is formedin the surface of the surface layer 56. The MOSFET 200 illustrated inFIG. 33 is formed by the manufacturing method described above.

According to the present embodiment, the method of manufacturing asemiconductor device capable of realizing a high breakdown voltage isprovided as in the first embodiment.

Further, a process of forming a trench for forming a trench contact bydry etching or the like is not necessary. Therefore, it is possible toeasily manufacture a trench contact type MOSFET having an SJ structure.

Meanwhile, in the present embodiment, a description is given of anexample in which a low impurity concentration region is selectivelyremoved by thermal oxidation with respect to an epitaxial growth layer.However, for example, it is also possible to selectively remove the lowimpurity concentration region by dry etching with respect to anepitaxial growth layer. For example, it is also possible to remove a lowimpurity concentration region immediately after performing ionimplantation using a mask material for the ion implantation of aluminumas a mask, and to form a groove in the surface of an epitaxial growthlayer.

In the first to fifth embodiments, a description is given of an examplein which 4H—SiC is used as a SiC crystal structure, but the exemplaryembodiment can also be applied to devices using SiC with other crystalstructures such as 6H—SiC and 3C—SiC. In addition, it is also possibleto employ a SiC substrate having a surface other than the (0001)surface.

In the first to fifth embodiments, a description is given of an examplein which a first conductivity type is an n type and a secondconductivity type is a p type. However, the first conductivity type maybe set as a p type, and the second conductivity type may be set as an ntype.

In the first to fifth embodiments, aluminum (Al) is illustrated as a ptype impurity, but it is also possible to use boron (B). In addition,nitrogen (N) is illustrated as an n type impurity, but it is alsopossible to apply phosphorus (P), arsenic (As), antimony (Sb), or thelike.

In the first to fifth embodiments, a planar gate MOSFET is described asan example, but the exemplary embodiment can also be applied to a trenchgate MOSFET.

In the first to fifth embodiments, a description is given of an examplein which the number of epitaxial layers for forming a p⁻ type pillarregion 16 is three or more. However, the number of epitaxial layers isnot limited to three, and any number of epitaxial layers may be usedinsofar as the number of epitaxial layers is two or more.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A method of manufacturing a semiconductor device,the method comprising: forming a second SiC layer of a firstconductivity type on a first SiC layer by epitaxial growth; forming afirst region of a second conductivity type by selectively ion-implantingfirst impurities of the second conductivity type into the second SiClayer; removing a portion of the first region; forming a third SiC layerof the first conductivity type on the second SiC layer by epitaxialgrowth; and forming a second region of the second conductivity type onthe first region by selectively ion-implanting second impurities of thesecond conductivity type into the third SiC layer.
 2. The methodaccording to claim 1, wherein the removing of the portion of the firstregion is performed by chemical mechanical polishing (CMP).
 3. Themethod according to claim 2, further comprising: after removing of theportion of the first region and before forming of the third SiC layer,removing a portion of the second SiC layer by anisotropic dry etchingusing a sulfur hexafluoride (SF₆) gas or a carbon tetrafluoride (CF₄)gas, or by isotropic dry etching.
 4. The method according to claim 2,further comprising: after removing of the portion of the first regionand before forming of the third SiC layer, removing a portion of thesecond SiC layer by forming a thermal oxide film on the second SiC layerand peeling off the thermal oxide film.
 5. The method according to claim2, further comprising: after removing of the portion of the first regionand before forming of the third SiC layer, removing a portion of thesecond SiC layer by wet etching.
 6. The method according to claim 1,wherein a portion of the first region is removed by forming a thermaloxide film on the first region and peeling off the thermal oxide film.7. The method according to claim 1, wherein a portion of the firstregion is removed by dry etching.
 8. The method according to claim 1,wherein when the portion of the first region is removed, a regionincluding a peak concentration position of the first impurities isremoved.
 9. The method according to claim 1, wherein when the portion ofthe first region is removed, a groove is formed in a surface of thesecond SiC layer.
 10. The method according to claim 1, wherein the firstimpurities and the second impurities are aluminum (Al).
 11. A method ofmanufacturing a semiconductor device, the method comprising: forming asecond SiC layer of a first conductivity type on a first SiC layer byepitaxial growth; forming a first region of a second conductivity typeby selectively ion-implanting first impurities of the secondconductivity type into the second SiC layer; forming a third SiC layerof the first conductivity type on the second SiC layer by epitaxialgrowth; and forming a second region of the second conductivity type onthe first region by selectively ion-implanting second impurities of thesecond conductivity type into and through the third SiC layer so that apeak concentration position of the second impurities is in the firstregion.
 12. The method according to claim 11, wherein the firstimpurities and the second impurities are aluminum (Al).
 13. The methodaccording to claim 11, wherein the ion-implanting of the secondimpurities is repeated until the peak concentration position of thesecond impurities is in the first region.
 14. The method according toclaim 11, further comprising: forming a fourth SiC layer of the firstconductivity type on the third SiC layer by epitaxial growth; andforming a third region of the second conductivity type on the secondregion by selectively ion-implanting third impurities of the secondconductivity type into and through the fourth SiC layer so that a peakconcentration position of the third impurities is in the second region.15. The method according to claim 14, wherein the ion-implanting of thethird impurities is repeated until the peak concentration position ofthe third impurities is in the second region.
 15. The method accordingto claim 14, wherein the ion-implanting of the third impurities isrepeated until the peak concentration position of the third impuritiesis in the second region.
 16. A method of manufacturing a semiconductordevice, the method comprising: forming a second SiC layer of a firstconductivity type on a first SiC layer by epitaxial growth; forming afirst region of a second conductivity type by selectively ion-implantingfirst impurities of the second conductivity type into the second SiClayer; forming a thermal oxide film on the first region and the secondSiC layer; peeling off the thermal oxide film, a groove being formed ina surface of the second SiC layer above the first region; forming athird SiC layer of the first conductivity type on the second SiC layerby epitaxial growth; and forming a second region of the secondconductivity type on the first region by selectively ion-implantingsecond impurities of the second conductivity type into the third SiClayer.
 17. The method according to claim 16, further comprising: forminga thermal oxide film on the second region and the third SiC layer;peeling off the thermal oxide film, a groove being formed in a surfaceof the third SiC layer above the second region; forming a fourth SiClayer of the first conductivity type on the second SiC layer byepitaxial growth; and forming a third region of the second conductivitytype on the second region by selectively ion-implanting third impuritiesof the second conductivity type into the fourth SiC layer.
 18. Themethod according to claim 17, wherein the first, second, and thirdimpurities are aluminum (Al).